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CGC Class 1000 Cleanroom Equipment
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Below, you can find the list of equipment available in Class 1000 Cleanroom. A few are already available for use, others are being installed and will become available later.
Please use the booking system to use the equipment.
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Plasma-Enhanced Chemical Vapour Deposition system (PE-CVD)
Model: Vision 310, Advanced Vacuum AB
Used for plasma-enhanced chemical vapour deposition system is used for depositing amorphous Si, SiO2 and Si3N4.
Gases connected: SiH4, NH3, N2O, N2
Users in charge:
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Reactive Ion Etcher (RIE)
Model: Vision 320, Advanced Vacuum AB
Used for reactive-ion etching of Si, SiO2 and Si3N4.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2.Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed).
Users in charge:
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Inductively-Coupled Reactive Ion Etcher (ICP-RIE) "APEX"
Model: APEX SLR, Advanced Vacuum AB
A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials: Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed).
Users in charge:
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Inductively-Coupled Reactive Ion Etcher (ICP-RIE) "Oxford"
Model: PlasmaLab 100, Oxford Instruments
A load-locked system for inductively-coupled reactive-ion etching of Si, SiO2 and Si3N4 with an enhanced rate and anisotropicity.
Gases connected: SF6, CHF3, C4F8, CF4, O2, Ar, N2
Compatible only with the following substrate/mask materials:
Si, Al, PR, SiO2, Si3N4 (exposed noble metal parts/masks are not allowed).
Users in charge:
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Reactive Ion Etcher "NanoEtch"
Model: NanoEtch, Moorfield Nanotechnology Ltd
The tool implements a unique soft-etching technology and provides the fine etching control crucial for graphene and 2D materials research in a convenient, benchtop package.
Gases connected: CF4, O2, Ar, N2.
Users in charge:
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Plasma Cleaner "Femto"
Model: Femto, Diener Electronics GmbH.
This is a low-pressure plasma system used for plasma cleaning of substrates and activating surfaces. Gases connected: O2, N2.
Users in charge:
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Electron-Beam Evaporator/Sputterer
Model: PVD 200 Pro, Kurt J. Lesker
This PVD tool is used for e-beam evaporation and sputter deposition of metals dielectrics.
Materials: Au, Ag, Cu, Cr, Ti, Al, Ni, Sn, Mo, ITO, SiO2, Al2O3.
Users in charge:
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Thermal Evaporator
Model: MiniLab 60, Moorfield Nanotechnology Ltd
Features: Manual and Automatic process modes, HMI, used for a thermal evaporation of selected metals.
Materials: Au, Ag, Cr, Al.
Users in charge:
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Atomic Layer Deposition (ALD)
Model: TFS200, Beneq
Used for Atomic Layer Deposition of Al2O3 and TiO2. Materials: liquid TMA and TiCl4 precursors.
Users in charge:
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Ar-filled Glovebox
Model: M-Braun
Inert-atmosphere (Ar) glovebox with a robotized 3D graphene transfer system and a thermal evaporator. The thermal evaporator can be accessed from the inside as well as outside of the glovebox. There is a spinner and a hotplate inside.
Users in charge:
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Transition-Metal Dichalcogenides Chemical Vapour Deposition system (TM-CVD)
Model: Planartech
A dual-furnace Chemical Vapour Deposition system for growth of 2D materials.
Users in charge:
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Plasma-Enhanced Graphene Chemical Deposition system (PE-G-CVD)
Model: Planartech
Plasma-Enhanced Chemical Vapour Deposition system for growth of high-quality graphene.
Users in charge:
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Graphene Transfer Systems x2
The tool is equipped with micro-manipulators and is based on Nikon Eclipse microscope.
Users in charge:
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1k-MTI-furnace
Model: MTI GTF-1200X
Users in charge:
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Acid Bench
This wetbench is used for graphene transfer, cleaning, and a number of other processes involving acids.
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Solvent Bench
This wetbench is used for cleaning, preparation of samples for deposition, etching, as well as any other operations requiring solvents.
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